DISCO DFL7161 激光切割机
High-quality, high-throughput standard laser grooving model Φ300 mm Ablation DFL7161 is a fully automatic laser saw for Φ300 mm wafers which has already seen wide use. It performs a series of pro…
Product introduction
High-quality, high-throughput standard laser grooving model
- Φ300 mm
- Ablation
- DFL7161 is a fully automatic laser saw for Φ300 mm wafers which has already seen wide use.
- It performs a series of processes from HogoMax* coating and dicing to automatic cleaning.
- The HogoMax coating and cleaning sections are located separately to significantly reduce waiting time.
*A water-soluble protective film that prevents laser processing particles from adhering to the wafer surface
Specifications
| Specification | Unit | ||
|---|---|---|---|
| Processing method | – | Ablation | |
| Max. workpiece size | mm | Φ300 | |
| X-axis (Chuck table) | Processing range | mm | 310 |
| Moving speed | mm/s | 1 ～ 1,000 | |
| Y-axis (Chuck table) | Processing range | mm | 310 |
| Index step | mm | 0.0001 | |
| Positioning accuracy | mm | 0.003/310 (Single error) 0.002/5 | |
| Z-axis | Moving resolution | mm | 0.000015 |
| Repeatability accuracy | mm | 0.002 | |
| θ-axis (Chuck table) | Max. rotating angle | deg | 330(standard) 380(option) |
| Equipment dimensions (W×D×H) | mm | 1,560 × 1,550 × 1,800 | |
| Equipment weight | kg | Approx. 2,300 | |
*Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.
