ASM AREO 焊线机
AERO Series Automatic Wire Bonder Features Horizontal wire bond Min. bond pad pitch (BPP) iHawk AERO (>=45µm BPP) Eagle AERO (30 – 45µm BPP) ASMPT latest patented X-Power technologies and rea…
Product introduction
AERO Series Automatic Wire Bonder
Features
- Horizontal wire bond
- Min. bond pad pitch (BPP)
- iHawk AERO (>=45µm BPP)
- Eagle AERO (30 – 45µm BPP)
- ASMPT latest patented X-Power technologies and real time monitoring
- Optional integrated with AEROEYE predictive maintenance
Dimensions
W x D x H = 1,200 x 900 x 1,760 mm
