KS IConn PLUS 焊线机
WIRE BONDING CAPABILITY Ultra Fine Pitch 40 μm pitch 0.6 mil to 1.2 mil copper wire Gold Wire Pitch Capability in Copper Configuration 35 μm pitch with 0.6 mil gold wire Bonding A…
Product introduction
| WIRE BONDING CAPABILITY | |
|---|---|
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Ultra Fine Pitch
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40 μm pitch 0.6 mil to 1.2 mil copper wire
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Gold Wire Pitch Capability in Copper Configuration
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35 μm pitch with 0.6 mil gold wire
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Bonding Area
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X Axis: 56 mm Y Axis: 80 mm
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Total Bond Placement Accuracy
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2.0 μm @ 3 sigma
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Pattern Recognition/Optics/Vision
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Progressive Scan Vision Engine CCD Video Camera ▪ Dual Magnification Optics (2x & 6x) ▪ Optional Programmable Focus for High Magnification
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| LOOPING CAPABILITY (with 25.4 μm wire diameter) | |
|---|---|
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Maximum Wire Length
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7.6 mm
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Minimum Loop Height
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100 μm standard & worked loops 70 μm folded & reverse loops 50 μm ultra-low loop with Power Series Low Loop
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Wire Sway
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Wire length < 2.54 mm: 25 μm @ 3 sigma Wire length > 2.54 mm: ± 1 % wire length @ 3 sigma
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| SET UP & CONVERSION TIMES | |
|---|---|
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Same Leadframe Type:
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< 4 min
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Different Leadframe Type:
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< 8 min
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| MAN-MACHINE INTERFACE | |
|---|---|
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Monitor
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17” color LCD display
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Durable control panel
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Function keys and dedicated buttons, and user-friendly mouse
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Industry-Recognized user interface
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Simple pull-down menus. Color-overlays of wire groups for easy programming and teach
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