{"id":68,"date":"2018-11-26T14:48:13","date_gmt":"2018-11-26T06:48:13","guid":{"rendered":"http:\/\/trade.jianzhanyes.com\/wp181126\/?p=68"},"modified":"2025-05-16T13:02:47","modified_gmt":"2025-05-16T05:02:47","slug":"product-one-title-ten","status":"publish","type":"post","link":"https:\/\/ysf-semi.com\/?p=68","title":{"rendered":"Besi Datacon 2200EVO"},"content":{"rendered":"
\n

Key Features<\/h2>\n<\/header>\n
\n
\n

High Performance at High Accuracy<\/h3>\n
    \n
  • Highest accuracy \u00b1 10 \u00b5m @ 3 Sigma (7 \u00b5m on request)<\/li>\n
  • High productivity, low cost-of-ownership<\/li>\n
  • Up to 4 working heads in one machine
    \u00a0<\/li>\n<\/ul>\n

    Multi-Chip Capability<\/h3>\n
      \n
    • Single pass production for complex products<\/li>\n
    • Die attach, flip chip, multi-chip in one machine<\/li>\n
    • Epoxy writing & stamping, flux dipping
      \u00a0<\/li>\n<\/ul>\n

      Unbeaten Flexibility<\/h3>\n
        \n
      • Die pick from wafer, waffle pack, gel pack, feeder<\/li>\n
      • Die place to carrier, boat, substrate, PCB, lead frame, wafer<\/li>\n
      • Hot and cold processes supported: epoxy, soldering, thermo-compression<\/li>\n
      • MCM, SiP, Hybrids
        \u00a0<\/li>\n<\/ul>\n

        Open Platform Architecture for Full Customization<\/h3>\n
          \n
        • Most advanced modular platform concept<\/li>\n
        • Production line tailored 100% to your needs<\/li>\n
        • Ideal solution with smallest footprint possible<\/li>\n<\/ul>\n<\/div>\n<\/div>\n\n\n

          Specifications<\/h2>\n\n\n\n

          Performance<\/h3>\n\n\n\n
            \n
          • X\/Y placement accuracy: \u00b1 10\u2005\u00b5m @ 3s<\/li>\n\n\n\n
          • Theta placement accuracy: \u00b1 0.15\u00b0 @ 3s<\/li>\n\n\n\n
          • Bond Force: 0.5N to 75N programmable
            \u00a0<\/li>\n<\/ul>\n\n\n\n

            UPH<\/h3>\n\n\n\n
              \n
            • Die attach: up to 7,000 UPH\/module<\/li>\n\n\n\n
            • Flip Chip with dipping: up to 2,500 UPH\/module<\/li>\n\n\n\n
            • Flip Chip without dipping: up to 3,200 UPH\/module
              \u00a0<\/li>\n<\/ul>\n\n\n\n

              Bond Heads<\/h3>\n\n\n\n
                \n
              • Standard bond head 0\u00b0 – 360\u00b0 rotation<\/li>\n\n\n\n
              • Heated bond head up to 450\u00b0C (optional)<\/li>\n\n\n\n
              • UV Curing (365 nm & 405 nm)
                \u00a0<\/li>\n<\/ul>\n\n\n\n

                Machine Dimensions<\/h3>\n\n\n\n
                  \n
                • LxDxH: 1,160\u2005mm x 1,225\u2005mm x 1,750\u2005mm<\/li>\n\n\n\n
                • Weight: 1,300 kg
                  \u00a0<\/li>\n<\/ul>\n\n\n\n

                  Statistics<\/h3>\n\n\n\n
                    \n
                  • Uptime > 98 %<\/li>\n\n\n\n
                  • Yield > 99.95 %
                    \u00a0<\/li>\n<\/ul>\n\n\n\n

                    Wafer<\/h3>\n\n\n\n
                      \n
                    • Die size Die Attach: 0.17\u2005mm – 50\u2005mm<\/li>\n\n\n\n
                    • Die size Flip Chip: 0.5\u2005mm – 50\u2005mm<\/li>\n\n\n\n
                    • Die thickness: >50\u2005\u00b5m (thinner on request)<\/li>\n\n\n\n
                    • Wafer size: 4″ – 12″ (SEMI M1)<\/li>\n\n\n\n
                    • Frame size: FF070, FF105, FF108, FF123; automatic change (others on request)
                      \u00a0<\/li>\n<\/ul>\n\n\n\n

                      Chip Trays<\/h3>\n\n\n\n
                        \n
                      • Waffle pack \/ Gel-Pak\u00ae 2\u201d x\u20052\u201d and\u00a0 4\u201d x\u20054\u201d<\/li>\n\n\n\n
                      • JEDEC tray on request
                        \u00a0<\/li>\n<\/ul>\n\n\n\n

                        Substrates and Carriers<\/h3>\n\n\n\n
                          \n
                        • FR4, ceramic, BGA, flex, boat, lead frame, waffle pack<\/li>\n\n\n\n
                        • Gel-Pak\u00ae, JEDEC tray, odd-shape substrates<\/li>\n\n\n\n
                        • Substrate working range: 13\u201d x 8\u201d (325\u2005mm x 200\u2005mm)
                          \u00a0<\/li>\n<\/ul>\n\n\n\n

                          Options<\/h3>\n\n\n\n
                            \n
                          • Hardware: Open platform architecture for full customization<\/li>\n\n\n\n
                          • Software: Single component tracking, CAD download, wafer mapping, substrate mapping, barcode scanner, datamatrix recognition\u00a0and more<\/li>\n<\/ul>\n","protected":false},"excerpt":{"rendered":"

                            Key Features High Performance at High Accuracy Highest […]<\/p>\n","protected":false},"author":1,"featured_media":281,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[7],"tags":[13,21,12],"class_list":["post-68","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-bdt","tag-one","tag-ten","tag-title"],"_links":{"self":[{"href":"https:\/\/ysf-semi.com\/index.php?rest_route=\/wp\/v2\/posts\/68","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/ysf-semi.com\/index.php?rest_route=\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/ysf-semi.com\/index.php?rest_route=\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/ysf-semi.com\/index.php?rest_route=\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/ysf-semi.com\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=68"}],"version-history":[{"count":3,"href":"https:\/\/ysf-semi.com\/index.php?rest_route=\/wp\/v2\/posts\/68\/revisions"}],"predecessor-version":[{"id":284,"href":"https:\/\/ysf-semi.com\/index.php?rest_route=\/wp\/v2\/posts\/68\/revisions\/284"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/ysf-semi.com\/index.php?rest_route=\/wp\/v2\/media\/281"}],"wp:attachment":[{"href":"https:\/\/ysf-semi.com\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=68"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/ysf-semi.com\/index.php?rest_route=%2Fwp%2Fv2%2Fcategories&post=68"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/ysf-semi.com\/index.php?rest_route=%2Fwp%2Fv2%2Ftags&post=68"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}